ALEXANDRIA, Va., Sept. 23 -- Advanced Micro Devices, Austin, Texas, has been assigned a patent (8,835,303) developed by Frank Feustel, Dresden, Germany, Thomas Werner, Moritzburg, Germany, and Kai Frohberg, Niederau, Germany, for a "metallization system of a semiconductor device comprising extra-tapered transition vias."

The patent application was filed on Dec. 9, 2009 (12/634,216). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Se . . .