3D Integrated Circuits Will Meet Miniaturisation Demands of Next-Generation Electronics
February 28, 2017
February 28, 2017
LONDON, Feb. 28 -- Frost and Sullivan, a provider of market research and analysis, growth strategy consulting and corporate training services across multiple industries, issued the following news release:
With 2D integrated circuit (IC) technology nearing its scaling limit, there is an urgent need to scale up vertically to cope with the breakneck pace of advances in digital technologies. However, the progress made by the digital components has not been matched by the advances in m . . .
With 2D integrated circuit (IC) technology nearing its scaling limit, there is an urgent need to scale up vertically to cope with the breakneck pace of advances in digital technologies. However, the progress made by the digital components has not been matched by the advances in m . . .